Distribution Of Bins, Installation Of Rfid Chips And Carrying Out A Door-to-door Survey Tender Details
Distribution Of Bins, Installation Of Rfid Chips And Carrying Out A Door-to-door Survey
SCT Ref. 2677978
Summary Distribution Of Bins, Installation Of Rfid Chips And Carrying Out A Door-to-door Survey
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Location Europe
Detailed Description Contract notice: distribution of bins, installation of rfid chips and carrying out a door-to-door survey in order to constitute a database for the reomi
Distribution of bins, installation of rfid chips and carrying out a door-to-door survey in order to build up a database for reomi.
This contract is divided into lots: no
Time limit for receipt of tenders or requests to participate: date: 03/05/2021 local time: 12:00
Conditions for opening tenders date: 05/03/2021 local time: 17:00 General public services
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